Gold to Gold Interconnection Ultrasonic Flip Chip Bonding (GGI)

Gold to Gold Interconnection Ultrasonic Flip Chip Bonding (GGI)

AFM-15 (Gold to gold ultrasonic process) Upgraded

Features
1. Excellent mounting accuracy in the industry (±8µm / 3o)

2. Excellent mounting cycle time in the industry (1.1 sec/IC, including processing time)

3. Low energy connection

4. Max 5mmIC Handling

5. Various functions for actual production

  AFM-22 (Ultra low cost and space saving)

Features
1. Max 30mmIC Handling

2 . Excellent mounting accuracy in the industry (± 2 µm / 3o)

3. Capable of Max Load 372.4N (* Available for low pressure capability equipment)

AFM-12 (Gold-gold ultrasonic process)

Features
1. The highest mounting accuracy in the industry (±10µm)

2. Mounting cycle time of 1.5/IC (excluding bonding time)

3. Lowest floor space required in the industry (1.1m²)

MDM-20 (Debut of multi-dispenser)

  Features
1. High-precision coating by newly-developed image processor.

2. Fine dispensing control by newly-developed processor.

3. The new best space saving in the industry

Gold-to-Gold Flip Chip Example: High Density LED

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