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Products and Services arrow Products and Services arrow PDR BGA REWORK STATION arrow PDR IR-XT5M MPR- Number 1 for BGA Rework on Mobile Phones
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PDR BGA REWORK STATION arrow PDR IR-XT5M MPR- Number 1 for BGA Rework on Mobile Phones



PDR IR-XT5M MPR- Number 1 for BGA Rework on Mobile Phones


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PDR IR-XT5M MPR- Number 1 for BGA Rework on Mobile Phones

The PDR IR-XT5M MPR SMT/BGA Rework System has been specifically designed to cope with the challenges of repairing today's mobile phone assemblies.

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The system is tip/nozzle free, instantly and precisely controllable, clean and produces high quality BGA rework without any complications. This system provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs and Flipchips and is ready for 0201 and lead-free applications.

The IR-XT5M MPR comes with an excellent good range of standard features allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It is hands-free, semi-automatic and comes with PDR’s user-friendly ThermoActiv V3 software suite.

  • Ideal for the hidden interconnects in a high density environment
  • Produces 100% yield BGA rework without any complications
  • Instant, visible, highly controllable heating
  • Tool free and gas free
  • Modular and upgradeable

 

PDR IR-XT5M - Features And Specifications

Advanced FIR Component Heating
  • Lens based FIR heating with adjustable image system
  • PDR lens attachments with IR image from 4 to 70mm diameter
  • Reworks all SMDs/BGAs including 0201s + lead free applications 
  • Large Area IR PCB Preheater System
  • Medium wave IR PCB preheating
  • 500W single zone (120mm x 120mm) 
  • PDR Lens Attachments
  • F200 (10 -28mm spotsize) standard

 

Precision Pick-up System

  • Vacuum operated pick and place with precise macro-micro Z axis movement
  • Micrometer control for soft component landing
  • 360° component rotation
  • Component nest and 'print frame' facility for paste application 
  • Macro-Micro X/Y PCB Table

 

Precision micrometer (Micro) control

  • +/- 10 microns (.0004") movement in X/Y directions
  • Macro override facility in all directions
  • Up to 17" x 20" (420mm x 500mm) capacity with lockable XY axis 

 

Non-Contact, IR Sensor for Measuring Component Temperature

  • Manually adjustable, K-type non-contact IR sensor
  • Realtime monitoring of component temperature throughout process  

 

K-Type Contact Probe for Measuring PCB Temp.

  • Manually attached, K-type thermocouple contact probe
  • Realtime monitoring of PCB temperature throughout process 

 

PDR ThermoActive V3 Software SuiteType 5, Digital controller Multi K-type thermocouple (x4) capacity for temp/time testingWindows 98/me/XP/NT Thermo Active V3 softwareRealtime, Closed loop component/PCB temp. control

 Drag and drop profile setting Precise X/Y axis mounting system




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